Pre-joining CMP contract processing
We ensure the surface roughness required by the customer and enable room temperature bonding.
We offer "pre-bond CMP contract processing" at our company. As an example of our processing achievements in pre-bond CMP, we can work with materials used in semiconductors and compound semiconductors such as Si, Cu, W, Ta, TaN, SiO2, TEOS, GaAs, SiC, GaN, and InP. We are capable of both homogeneous bonding and bonding between these different materials. Before processing your wafers through our CMP contract processing, we will meet your needs with reliable technology backed by numerous in-house experiments. 【Example of Processing Achievements】 ■ Single Crystal Oxides - LiNbO3, LiTaO3, Al2O3 (Sapphire), etc. ■ Polycrystalline Materials - Poly-Si, SiC, Al2O3/YAG, etc. ■ Metals - Au, Pt, Ag, Cu, Ti, TiN, Ni, W, Al, Sn, Pb, Zn, etc. ■ Ceramics - Alumina, Ferrite, Zirconia *For more details, please refer to the PDF document or feel free to contact us.
- Company：D-process
- Price：Other
